China Achieves Major Breakthrough in Lithography, Shocks Global Semiconductor Industry

· Tech

Due to U.S. technology restrictions, China has been unable to secure ASML’s most advanced extreme ultraviolet (EUV) equipment. However, Shenzhen-based chip equipment maker SiCarrier Technologies, established just four years ago, recently unveiled its 28‑nanometer lithography technology for 300‑mm wafers for the first time, showcasing China’s indigenous R&D achievements in advanced semiconductor equipment and drawing keen global attention.

On March 26–27, SiCarrier Technologies debuted five new process equipment models at SEMICON China 2025, including an epitaxial deposition system dubbed “Mount Emei,” an atomic layer deposition (ALD) system named “Mount Ali,” a physical vapor deposition (PVD) system called “Mount Putuo,” an etching system designated “Mount Wuyi,” and a chemical vapor deposition (CVD) system labeled “Mount Changbai.”

These product names refer to critical technical nodes in semiconductor manufacturing. For instance, epitaxial deposition (EPI) is a key process for advanced nodes and third-generation semiconductors, directly affecting chip performance and reliability; ALD, which enables atomic-scale film deposition, is central to processes below the 5‑nanometer node; while CVD is among the most in-demand equipment types, required for film deposition across nodes ranging from 28‑nanometer to 5‑nanometer.

broken image

The 28‑nanometer lithography machine, developed in collaboration with Huawei, is primarily intended to replace international semiconductor equipment giants such as ASML, bolster domestic autonomy, and overcome U.S. export controls on advanced chip equipment—a development hailed in China as a lifeline for advanced semiconductor processes.

Industry analysts point out that the 28‑nanometer node represents the dividing line between mature and advanced processes, posing a critical hurdle for Chinese semiconductor equipment manufacturers. SiCarrier’s breakthrough thus marks significant progress for domestic equipment in these key process areas.

Founded in August 2021 with funding from the Shenzhen municipal government, SiCarrier Technologies is committed to developing semiconductor manufacturing equipment. It has established R&D centers in Beijing, Shanghai, Xi’an, and other cities, recruiting top technical talent from the industry—including engineers with experience at ASML, Applied Materials, Lam Research, and Tokyo Electron.

Despite its short history, SiCarrier has demonstrated strong market ambition, counting industry leaders such as SMIC and HHGrace among its customers. In addition, some of its etching equipment has already been deployed in mass production on power semiconductor lines.

SiCarrier plans to expand its R&D network to more than 10 cities within the next three years and to set up technical service centers in Europe and Southeast Asia, thereby providing professional support to customers and broadening its global influence.